JPS5035047A - - Google Patents
Info
- Publication number
- JPS5035047A JPS5035047A JP8696173A JP8696173A JPS5035047A JP S5035047 A JPS5035047 A JP S5035047A JP 8696173 A JP8696173 A JP 8696173A JP 8696173 A JP8696173 A JP 8696173A JP S5035047 A JPS5035047 A JP S5035047A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8696173A JPS5035047A (ja) | 1973-08-01 | 1973-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8696173A JPS5035047A (ja) | 1973-08-01 | 1973-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5035047A true JPS5035047A (ja) | 1975-04-03 |
Family
ID=13901456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8696173A Pending JPS5035047A (ja) | 1973-08-01 | 1973-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5035047A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5256364A (en) * | 1975-11-05 | 1977-05-09 | Matsushita Electric Ind Co Ltd | Method of producing thick film circuit board |
| JPS5259848A (en) * | 1975-11-11 | 1977-05-17 | Matsushita Electric Ind Co Ltd | Method of producing thick film circuit board |
| JPS5426476A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Reflow solder dipping device |
-
1973
- 1973-08-01 JP JP8696173A patent/JPS5035047A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5256364A (en) * | 1975-11-05 | 1977-05-09 | Matsushita Electric Ind Co Ltd | Method of producing thick film circuit board |
| JPS587076B2 (ja) * | 1975-11-05 | 1983-02-08 | 松下電器産業株式会社 | アツマクカイロバンノセイゾウホウ |
| JPS5259848A (en) * | 1975-11-11 | 1977-05-17 | Matsushita Electric Ind Co Ltd | Method of producing thick film circuit board |
| JPS5738197B2 (ja) * | 1975-11-11 | 1982-08-13 | ||
| JPS5426476A (en) * | 1977-07-29 | 1979-02-28 | Fujitsu Ltd | Reflow solder dipping device |