JPS5034909B1 - - Google Patents

Info

Publication number
JPS5034909B1
JPS5034909B1 JP45013580A JP1358070A JPS5034909B1 JP S5034909 B1 JPS5034909 B1 JP S5034909B1 JP 45013580 A JP45013580 A JP 45013580A JP 1358070 A JP1358070 A JP 1358070A JP S5034909 B1 JPS5034909 B1 JP S5034909B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45013580A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45013580A priority Critical patent/JPS5034909B1/ja
Publication of JPS5034909B1 publication Critical patent/JPS5034909B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Wire Bonding (AREA)
JP45013580A 1970-02-17 1970-02-17 Pending JPS5034909B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP45013580A JPS5034909B1 (ja) 1970-02-17 1970-02-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45013580A JPS5034909B1 (ja) 1970-02-17 1970-02-17

Publications (1)

Publication Number Publication Date
JPS5034909B1 true JPS5034909B1 (ja) 1975-11-12

Family

ID=11837095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45013580A Pending JPS5034909B1 (ja) 1970-02-17 1970-02-17

Country Status (1)

Country Link
JP (1) JPS5034909B1 (ja)

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