JPS5033970B1 - - Google Patents

Info

Publication number
JPS5033970B1
JPS5033970B1 JP45068616A JP6861670A JPS5033970B1 JP S5033970 B1 JPS5033970 B1 JP S5033970B1 JP 45068616 A JP45068616 A JP 45068616A JP 6861670 A JP6861670 A JP 6861670A JP S5033970 B1 JPS5033970 B1 JP S5033970B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45068616A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5033970B1 publication Critical patent/JPS5033970B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP45068616A 1969-08-04 1970-08-04 Pending JPS5033970B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84742169A 1969-08-04 1969-08-04

Publications (1)

Publication Number Publication Date
JPS5033970B1 true JPS5033970B1 (ja) 1975-11-05

Family

ID=25300584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45068616A Pending JPS5033970B1 (ja) 1969-08-04 1970-08-04

Country Status (4)

Country Link
US (1) US3635758A (ja)
JP (1) JPS5033970B1 (ja)
AU (1) AU1833470A (ja)
CA (1) CA927220A (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition
US3873357A (en) * 1971-11-26 1975-03-25 Western Electric Co Method of depositing a metal on a surface of a substrate
US3873360A (en) * 1971-11-26 1975-03-25 Western Electric Co Method of depositing a metal on a surface of a substrate
BE794048A (fr) * 1972-01-17 1973-07-16 Dynachem Corp Procede et solution de revetement de cuivre sans traitement electrique
US3964906A (en) * 1973-12-12 1976-06-22 Western Electric Company, Inc. Method of forming a hydrophobic surface by exposing a colloidal sol to UV radiation
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating
US4217182A (en) * 1978-06-07 1980-08-12 Litton Systems, Inc. Semi-additive process of manufacturing a printed circuit
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
DE4440299A1 (de) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
US5753309A (en) * 1995-12-19 1998-05-19 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US5721014A (en) * 1995-12-19 1998-02-24 Surface Tek Specialty Products, Inc. Composition and method for reducing copper oxide to metallic copper
US5900186A (en) * 1995-12-19 1999-05-04 Morton International, Inc. Composition and method for reducing copper oxide to metallic copper
US5853798A (en) * 1997-09-12 1998-12-29 United Technologies Corporation Process for formation of an electrode on an anion exchange membrane
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
US7410899B2 (en) * 2005-09-20 2008-08-12 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications
EP1938367A2 (en) * 2005-09-20 2008-07-02 Enthone, Inc. Defectivity and process control of electroless deposition in microelectronics applications

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3257215A (en) * 1963-06-18 1966-06-21 Day Company Electroless copper plating
US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition

Also Published As

Publication number Publication date
CA927220A (en) 1973-05-29
AU1833470A (en) 1972-02-10
US3635758A (en) 1972-01-18

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