JPS5033093Y1 - - Google Patents

Info

Publication number
JPS5033093Y1
JPS5033093Y1 JP1969083995U JP8399569U JPS5033093Y1 JP S5033093 Y1 JPS5033093 Y1 JP S5033093Y1 JP 1969083995 U JP1969083995 U JP 1969083995U JP 8399569 U JP8399569 U JP 8399569U JP S5033093 Y1 JPS5033093 Y1 JP S5033093Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1969083995U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1969083995U priority Critical patent/JPS5033093Y1/ja
Publication of JPS5033093Y1 publication Critical patent/JPS5033093Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1969083995U 1969-09-05 1969-09-05 Expired JPS5033093Y1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1969083995U JPS5033093Y1 (ja) 1969-09-05 1969-09-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1969083995U JPS5033093Y1 (ja) 1969-09-05 1969-09-05

Publications (1)

Publication Number Publication Date
JPS5033093Y1 true JPS5033093Y1 (ja) 1975-09-26

Family

ID=33069677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1969083995U Expired JPS5033093Y1 (ja) 1969-09-05 1969-09-05

Country Status (1)

Country Link
JP (1) JPS5033093Y1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246226B (zh) * 2012-06-28 2015-12-02 山内株式会社 缓冲橡胶部件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104246226B (zh) * 2012-06-28 2015-12-02 山内株式会社 缓冲橡胶部件

Similar Documents

Publication Publication Date Title
AU2270770A (ja)
AU465452B2 (ja)
AU429630B2 (ja)
AU450150B2 (ja)
AU2355770A (ja)
AU442375B2 (ja)
AU427401B2 (ja)
AU470301B1 (ja)
AU442463B2 (ja)
AU442554B2 (ja)
AU428129B2 (ja)
AU428131B2 (ja)
AU417208B2 (ja)
AU470661B1 (ja)
AU438128B2 (ja)
AU425297B2 (ja)
AU442285B2 (ja)
AU442322B2 (ja)
AU442357B2 (ja)
AU414607B2 (ja)
AU442380B2 (ja)
AU410358B2 (ja)
AU442535B2 (ja)
AU442538B2 (ja)
AU5077469A (ja)