JPS5033091Y1 - - Google Patents

Info

Publication number
JPS5033091Y1
JPS5033091Y1 JP1969078376U JP7837669U JPS5033091Y1 JP S5033091 Y1 JPS5033091 Y1 JP S5033091Y1 JP 1969078376 U JP1969078376 U JP 1969078376U JP 7837669 U JP7837669 U JP 7837669U JP S5033091 Y1 JPS5033091 Y1 JP S5033091Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1969078376U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1969078376U priority Critical patent/JPS5033091Y1/ja
Publication of JPS5033091Y1 publication Critical patent/JPS5033091Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Wire Bonding (AREA)
JP1969078376U 1969-08-18 1969-08-18 Expired JPS5033091Y1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1969078376U JPS5033091Y1 (ja) 1969-08-18 1969-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1969078376U JPS5033091Y1 (ja) 1969-08-18 1969-08-18

Publications (1)

Publication Number Publication Date
JPS5033091Y1 true JPS5033091Y1 (ja) 1975-09-26

Family

ID=33067539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1969078376U Expired JPS5033091Y1 (ja) 1969-08-18 1969-08-18

Country Status (1)

Country Link
JP (1) JPS5033091Y1 (ja)

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