JPS5032957U - - Google Patents
Info
- Publication number
- JPS5032957U JPS5032957U JP1973084521U JP8452173U JPS5032957U JP S5032957 U JPS5032957 U JP S5032957U JP 1973084521 U JP1973084521 U JP 1973084521U JP 8452173 U JP8452173 U JP 8452173U JP S5032957 U JPS5032957 U JP S5032957U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973084521U JPS5032957U (enExample) | 1973-07-20 | 1973-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1973084521U JPS5032957U (enExample) | 1973-07-20 | 1973-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5032957U true JPS5032957U (enExample) | 1975-04-10 |
Family
ID=28265752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1973084521U Pending JPS5032957U (enExample) | 1973-07-20 | 1973-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5032957U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158199U (enExample) * | 1984-09-25 | 1986-04-18 | ||
| JP2018046186A (ja) * | 2016-09-15 | 2018-03-22 | 株式会社デンソー | 半導体装置およびその製造方法 |
-
1973
- 1973-07-20 JP JP1973084521U patent/JPS5032957U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158199U (enExample) * | 1984-09-25 | 1986-04-18 | ||
| JP2018046186A (ja) * | 2016-09-15 | 2018-03-22 | 株式会社デンソー | 半導体装置およびその製造方法 |