JPS5032881A - - Google Patents

Info

Publication number
JPS5032881A
JPS5032881A JP48083154A JP8315473A JPS5032881A JP S5032881 A JPS5032881 A JP S5032881A JP 48083154 A JP48083154 A JP 48083154A JP 8315473 A JP8315473 A JP 8315473A JP S5032881 A JPS5032881 A JP S5032881A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48083154A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48083154A priority Critical patent/JPS5032881A/ja
Publication of JPS5032881A publication Critical patent/JPS5032881A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/921Structures or relative sizes of bond pads
    • H10W72/926Multiple bond pads having different sizes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/932Plan-view shape, i.e. in top view

Landscapes

  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP48083154A 1973-07-25 1973-07-25 Pending JPS5032881A (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48083154A JPS5032881A (enExample) 1973-07-25 1973-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48083154A JPS5032881A (enExample) 1973-07-25 1973-07-25

Publications (1)

Publication Number Publication Date
JPS5032881A true JPS5032881A (enExample) 1975-03-29

Family

ID=13794308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48083154A Pending JPS5032881A (enExample) 1973-07-25 1973-07-25

Country Status (1)

Country Link
JP (1) JPS5032881A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361481U (enExample) * 1976-10-28 1978-05-25
JPS5775465A (en) * 1980-10-29 1982-05-12 Mitsubishi Electric Corp Semiconductor device
JPH0275805A (ja) * 1988-09-08 1990-03-15 Miura Co Ltd 軸対称斜流式貫流ボイラー

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5361481U (enExample) * 1976-10-28 1978-05-25
JPS5775465A (en) * 1980-10-29 1982-05-12 Mitsubishi Electric Corp Semiconductor device
JPH0275805A (ja) * 1988-09-08 1990-03-15 Miura Co Ltd 軸対称斜流式貫流ボイラー

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