JPS5032881A - - Google Patents
Info
- Publication number
- JPS5032881A JPS5032881A JP48083154A JP8315473A JPS5032881A JP S5032881 A JPS5032881 A JP S5032881A JP 48083154 A JP48083154 A JP 48083154A JP 8315473 A JP8315473 A JP 8315473A JP S5032881 A JPS5032881 A JP S5032881A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48083154A JPS5032881A (enrdf_load_stackoverflow) | 1973-07-25 | 1973-07-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP48083154A JPS5032881A (enrdf_load_stackoverflow) | 1973-07-25 | 1973-07-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5032881A true JPS5032881A (enrdf_load_stackoverflow) | 1975-03-29 |
Family
ID=13794308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48083154A Pending JPS5032881A (enrdf_load_stackoverflow) | 1973-07-25 | 1973-07-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5032881A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5361481U (enrdf_load_stackoverflow) * | 1976-10-28 | 1978-05-25 | ||
JPS5775465A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Semiconductor device |
JPH0275805A (ja) * | 1988-09-08 | 1990-03-15 | Miura Co Ltd | 軸対称斜流式貫流ボイラー |
-
1973
- 1973-07-25 JP JP48083154A patent/JPS5032881A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5361481U (enrdf_load_stackoverflow) * | 1976-10-28 | 1978-05-25 | ||
JPS5775465A (en) * | 1980-10-29 | 1982-05-12 | Mitsubishi Electric Corp | Semiconductor device |
JPH0275805A (ja) * | 1988-09-08 | 1990-03-15 | Miura Co Ltd | 軸対称斜流式貫流ボイラー |