JPS5032047A - - Google Patents
Info
- Publication number
- JPS5032047A JPS5032047A JP8329173A JP8329173A JPS5032047A JP S5032047 A JPS5032047 A JP S5032047A JP 8329173 A JP8329173 A JP 8329173A JP 8329173 A JP8329173 A JP 8329173A JP S5032047 A JPS5032047 A JP S5032047A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8329173A JPS5032047A (enExample) | 1973-07-24 | 1973-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8329173A JPS5032047A (enExample) | 1973-07-24 | 1973-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5032047A true JPS5032047A (enExample) | 1975-03-28 |
Family
ID=13798275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8329173A Pending JPS5032047A (enExample) | 1973-07-24 | 1973-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5032047A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000037716A1 (fr) * | 1998-12-21 | 2000-06-29 | Tokyo Electron Limited | Procede de placage, appareil et systeme a cet effet |
| JP2010232439A (ja) * | 2009-03-27 | 2010-10-14 | Kyocera Corp | 配線基板、配線基板の製造方法及び配線基板を用いた電子装置 |
-
1973
- 1973-07-24 JP JP8329173A patent/JPS5032047A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000037716A1 (fr) * | 1998-12-21 | 2000-06-29 | Tokyo Electron Limited | Procede de placage, appareil et systeme a cet effet |
| US6428661B1 (en) | 1998-12-21 | 2002-08-06 | Tokyo Electron Ltd. | Plating apparatus |
| JP2010232439A (ja) * | 2009-03-27 | 2010-10-14 | Kyocera Corp | 配線基板、配線基板の製造方法及び配線基板を用いた電子装置 |