JPS5032047A - - Google Patents

Info

Publication number
JPS5032047A
JPS5032047A JP8329173A JP8329173A JPS5032047A JP S5032047 A JPS5032047 A JP S5032047A JP 8329173 A JP8329173 A JP 8329173A JP 8329173 A JP8329173 A JP 8329173A JP S5032047 A JPS5032047 A JP S5032047A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8329173A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8329173A priority Critical patent/JPS5032047A/ja
Publication of JPS5032047A publication Critical patent/JPS5032047A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
JP8329173A 1973-07-24 1973-07-24 Pending JPS5032047A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8329173A JPS5032047A (enrdf_load_stackoverflow) 1973-07-24 1973-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8329173A JPS5032047A (enrdf_load_stackoverflow) 1973-07-24 1973-07-24

Publications (1)

Publication Number Publication Date
JPS5032047A true JPS5032047A (enrdf_load_stackoverflow) 1975-03-28

Family

ID=13798275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8329173A Pending JPS5032047A (enrdf_load_stackoverflow) 1973-07-24 1973-07-24

Country Status (1)

Country Link
JP (1) JPS5032047A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000037716A1 (en) * 1998-12-21 2000-06-29 Tokyo Electron Limited Plating apparatus, plating system, method for plating using the same
JP2010232439A (ja) * 2009-03-27 2010-10-14 Kyocera Corp 配線基板、配線基板の製造方法及び配線基板を用いた電子装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000037716A1 (en) * 1998-12-21 2000-06-29 Tokyo Electron Limited Plating apparatus, plating system, method for plating using the same
US6428661B1 (en) 1998-12-21 2002-08-06 Tokyo Electron Ltd. Plating apparatus
JP2010232439A (ja) * 2009-03-27 2010-10-14 Kyocera Corp 配線基板、配線基板の製造方法及び配線基板を用いた電子装置

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