JPS5031542B1 - - Google Patents

Info

Publication number
JPS5031542B1
JPS5031542B1 JP44092186A JP9218669A JPS5031542B1 JP S5031542 B1 JPS5031542 B1 JP S5031542B1 JP 44092186 A JP44092186 A JP 44092186A JP 9218669 A JP9218669 A JP 9218669A JP S5031542 B1 JPS5031542 B1 JP S5031542B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44092186A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP44092186A priority Critical patent/JPS5031542B1/ja
Publication of JPS5031542B1 publication Critical patent/JPS5031542B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP44092186A 1969-11-19 1969-11-19 Pending JPS5031542B1 (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP44092186A JPS5031542B1 (xx) 1969-11-19 1969-11-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP44092186A JPS5031542B1 (xx) 1969-11-19 1969-11-19

Publications (1)

Publication Number Publication Date
JPS5031542B1 true JPS5031542B1 (xx) 1975-10-13

Family

ID=14047393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44092186A Pending JPS5031542B1 (xx) 1969-11-19 1969-11-19

Country Status (1)

Country Link
JP (1) JPS5031542B1 (xx)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352441U (xx) * 1976-10-07 1978-05-04
JPS5352440U (xx) * 1976-10-07 1978-05-04
JPS5369032U (xx) * 1976-11-11 1978-06-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352441U (xx) * 1976-10-07 1978-05-04
JPS5352440U (xx) * 1976-10-07 1978-05-04
JPS5369032U (xx) * 1976-11-11 1978-06-09

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