JPS5030998B1 - - Google Patents
Info
- Publication number
- JPS5030998B1 JPS5030998B1 JP45021017A JP2101770A JPS5030998B1 JP S5030998 B1 JPS5030998 B1 JP S5030998B1 JP 45021017 A JP45021017 A JP 45021017A JP 2101770 A JP2101770 A JP 2101770A JP S5030998 B1 JPS5030998 B1 JP S5030998B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45021017A JPS5030998B1 (ja) | 1970-03-11 | 1970-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45021017A JPS5030998B1 (ja) | 1970-03-11 | 1970-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5030998B1 true JPS5030998B1 (ja) | 1975-10-06 |
Family
ID=12043259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45021017A Pending JPS5030998B1 (ja) | 1970-03-11 | 1970-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5030998B1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240099469A (ko) | 2021-12-10 | 2024-06-28 | 니토 보세키 가부시기가이샤 | 핵산의 대상 염기 서열 중에 있어서의 변이를 검출하기 위한 방법, 핵산의 증폭을 선택적으로 저해하는 방법, 및 이것들을 실시하기 위한 키트 |
| KR20240099467A (ko) | 2021-12-10 | 2024-06-28 | 니토 보세키 가부시기가이샤 | 핵산의 대상 염기 서열 중에 있어서의 변이를 검출하기 위한 방법, 핵산의 증폭을 선택적으로 저해하는 방법, 및 이것들을 실시하기 위한 키트 |
| KR20240099441A (ko) | 2021-12-10 | 2024-06-28 | 니토 보세키 가부시기가이샤 | 2 본쇄 핵산의 융해 온도 상승화제 및 그 용도 |
-
1970
- 1970-03-11 JP JP45021017A patent/JPS5030998B1/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240099469A (ko) | 2021-12-10 | 2024-06-28 | 니토 보세키 가부시기가이샤 | 핵산의 대상 염기 서열 중에 있어서의 변이를 검출하기 위한 방법, 핵산의 증폭을 선택적으로 저해하는 방법, 및 이것들을 실시하기 위한 키트 |
| KR20240099467A (ko) | 2021-12-10 | 2024-06-28 | 니토 보세키 가부시기가이샤 | 핵산의 대상 염기 서열 중에 있어서의 변이를 검출하기 위한 방법, 핵산의 증폭을 선택적으로 저해하는 방법, 및 이것들을 실시하기 위한 키트 |
| KR20240099441A (ko) | 2021-12-10 | 2024-06-28 | 니토 보세키 가부시기가이샤 | 2 본쇄 핵산의 융해 온도 상승화제 및 그 용도 |
| KR102728359B1 (ko) | 2021-12-10 | 2024-11-11 | 니토 보세키 가부시기가이샤 | 2 본쇄 핵산의 융해 온도 상승화제 및 그 용도 |
| KR102731760B1 (ko) | 2021-12-10 | 2024-11-21 | 니토 보세키 가부시기가이샤 | 핵산의 대상 염기 서열 중에 있어서의 변이를 검출하기 위한 방법, 핵산의 증폭을 선택적으로 저해하는 방법, 및 이것들을 실시하기 위한 키트 |
| KR102731759B1 (ko) | 2021-12-10 | 2024-11-21 | 니토 보세키 가부시기가이샤 | 핵산의 대상 염기 서열 중에 있어서의 변이를 검출하기 위한 방법, 핵산의 증폭을 선택적으로 저해하는 방법, 및 이것들을 실시하기 위한 키트 |