JPS5030753A - - Google Patents
Info
- Publication number
- JPS5030753A JPS5030753A JP8064673A JP8064673A JPS5030753A JP S5030753 A JPS5030753 A JP S5030753A JP 8064673 A JP8064673 A JP 8064673A JP 8064673 A JP8064673 A JP 8064673A JP S5030753 A JPS5030753 A JP S5030753A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8064673A JPS554835B2 (ja) | 1973-07-20 | 1973-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8064673A JPS554835B2 (ja) | 1973-07-20 | 1973-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5030753A true JPS5030753A (ja) | 1975-03-27 |
| JPS554835B2 JPS554835B2 (ja) | 1980-02-01 |
Family
ID=13724119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8064673A Expired JPS554835B2 (ja) | 1973-07-20 | 1973-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS554835B2 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5984491A (ja) * | 1982-11-05 | 1984-05-16 | 電気化学工業株式会社 | 混成集成回路基板の製造方法 |
| CN109168267A (zh) * | 2018-10-25 | 2019-01-08 | 铜陵市超远科技有限公司 | 一种高频微波覆铜板蚀刻工艺 |
-
1973
- 1973-07-20 JP JP8064673A patent/JPS554835B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5984491A (ja) * | 1982-11-05 | 1984-05-16 | 電気化学工業株式会社 | 混成集成回路基板の製造方法 |
| CN109168267A (zh) * | 2018-10-25 | 2019-01-08 | 铜陵市超远科技有限公司 | 一种高频微波覆铜板蚀刻工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS554835B2 (ja) | 1980-02-01 |