JPS5029415Y1 - - Google Patents
Info
- Publication number
- JPS5029415Y1 JPS5029415Y1 JP1970085677U JP8567770U JPS5029415Y1 JP S5029415 Y1 JPS5029415 Y1 JP S5029415Y1 JP 1970085677 U JP1970085677 U JP 1970085677U JP 8567770 U JP8567770 U JP 8567770U JP S5029415 Y1 JPS5029415 Y1 JP S5029415Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1970085677U JPS5029415Y1 (oth) | 1970-08-28 | 1970-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1970085677U JPS5029415Y1 (oth) | 1970-08-28 | 1970-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5029415Y1 true JPS5029415Y1 (oth) | 1975-08-29 |
Family
ID=33070333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1970085677U Expired JPS5029415Y1 (oth) | 1970-08-28 | 1970-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5029415Y1 (oth) |
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1970
- 1970-08-28 JP JP1970085677U patent/JPS5029415Y1/ja not_active Expired