JPS5029228Y2 - - Google Patents

Info

Publication number
JPS5029228Y2
JPS5029228Y2 JP2650471U JP2650471U JPS5029228Y2 JP S5029228 Y2 JPS5029228 Y2 JP S5029228Y2 JP 2650471 U JP2650471 U JP 2650471U JP 2650471 U JP2650471 U JP 2650471U JP S5029228 Y2 JPS5029228 Y2 JP S5029228Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2650471U
Other versions
JPS4724735U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2650471U priority Critical patent/JPS5029228Y2/ja
Publication of JPS4724735U publication Critical patent/JPS4724735U/ja
Application granted granted Critical
Publication of JPS5029228Y2 publication Critical patent/JPS5029228Y2/ja
Expired legal-status Critical Current

Links

JP2650471U 1971-04-08 1971-04-08 Expired JPS5029228Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2650471U JPS5029228Y2 (ja) 1971-04-08 1971-04-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2650471U JPS5029228Y2 (ja) 1971-04-08 1971-04-08

Publications (2)

Publication Number Publication Date
JPS4724735U JPS4724735U (ja) 1972-11-20
JPS5029228Y2 true JPS5029228Y2 (ja) 1975-08-28

Family

ID=27885381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2650471U Expired JPS5029228Y2 (ja) 1971-04-08 1971-04-08

Country Status (1)

Country Link
JP (1) JPS5029228Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition

Also Published As

Publication number Publication date
JPS4724735U (ja) 1972-11-20

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