JPS5028769A - - Google Patents
Info
- Publication number
- JPS5028769A JPS5028769A JP48078336A JP7833673A JPS5028769A JP S5028769 A JPS5028769 A JP S5028769A JP 48078336 A JP48078336 A JP 48078336A JP 7833673 A JP7833673 A JP 7833673A JP S5028769 A JPS5028769 A JP S5028769A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48078336A JPS5028769A (sl) | 1973-07-13 | 1973-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48078336A JPS5028769A (sl) | 1973-07-13 | 1973-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5028769A true JPS5028769A (sl) | 1975-03-24 |
Family
ID=13659120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48078336A Pending JPS5028769A (sl) | 1973-07-13 | 1973-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5028769A (sl) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52171243U (sl) * | 1976-06-18 | 1977-12-26 | ||
| JPS61140533U (sl) * | 1985-02-21 | 1986-08-30 | ||
| JP2002313972A (ja) * | 2001-04-18 | 2002-10-25 | Matsushita Electric Ind Co Ltd | 電子部品組立体および電子部品組立体の製造方法 |
-
1973
- 1973-07-13 JP JP48078336A patent/JPS5028769A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52171243U (sl) * | 1976-06-18 | 1977-12-26 | ||
| JPS61140533U (sl) * | 1985-02-21 | 1986-08-30 | ||
| JP2002313972A (ja) * | 2001-04-18 | 2002-10-25 | Matsushita Electric Ind Co Ltd | 電子部品組立体および電子部品組立体の製造方法 |
| JP4659257B2 (ja) * | 2001-04-18 | 2011-03-30 | パナソニック株式会社 | 電子部品組立体の製造方法 |