JPS5028766A - - Google Patents

Info

Publication number
JPS5028766A
JPS5028766A JP48078378A JP7837873A JPS5028766A JP S5028766 A JPS5028766 A JP S5028766A JP 48078378 A JP48078378 A JP 48078378A JP 7837873 A JP7837873 A JP 7837873A JP S5028766 A JPS5028766 A JP S5028766A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48078378A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48078378A priority Critical patent/JPS5028766A/ja
Publication of JPS5028766A publication Critical patent/JPS5028766A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Wire Bonding (AREA)
JP48078378A 1973-07-13 1973-07-13 Pending JPS5028766A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48078378A JPS5028766A (ja) 1973-07-13 1973-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48078378A JPS5028766A (ja) 1973-07-13 1973-07-13

Publications (1)

Publication Number Publication Date
JPS5028766A true JPS5028766A (ja) 1975-03-24

Family

ID=13660343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48078378A Pending JPS5028766A (ja) 1973-07-13 1973-07-13

Country Status (1)

Country Link
JP (1) JPS5028766A (ja)

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