JPS5028763A - - Google Patents

Info

Publication number
JPS5028763A
JPS5028763A JP7835373A JP7835373A JPS5028763A JP S5028763 A JPS5028763 A JP S5028763A JP 7835373 A JP7835373 A JP 7835373A JP 7835373 A JP7835373 A JP 7835373A JP S5028763 A JPS5028763 A JP S5028763A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7835373A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7835373A priority Critical patent/JPS5028763A/ja
Publication of JPS5028763A publication Critical patent/JPS5028763A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP7835373A 1973-07-13 1973-07-13 Pending JPS5028763A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7835373A JPS5028763A (enrdf_load_stackoverflow) 1973-07-13 1973-07-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7835373A JPS5028763A (enrdf_load_stackoverflow) 1973-07-13 1973-07-13

Publications (1)

Publication Number Publication Date
JPS5028763A true JPS5028763A (enrdf_load_stackoverflow) 1975-03-24

Family

ID=13659609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7835373A Pending JPS5028763A (enrdf_load_stackoverflow) 1973-07-13 1973-07-13

Country Status (1)

Country Link
JP (1) JPS5028763A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114833A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Bubble memory device
JPS5320718A (en) * 1976-08-10 1978-02-25 Nippon Telegr & Teleph Corp <Ntt> Transmission system for facsimile signal storage
JPS5470365U (enrdf_load_stackoverflow) * 1977-10-26 1979-05-18
US4539582A (en) * 1980-06-10 1985-09-03 Tokyo Shibaura Denki Kabushiki Kaisha Anti-short bonding pad structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114833A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Bubble memory device
JPS5320718A (en) * 1976-08-10 1978-02-25 Nippon Telegr & Teleph Corp <Ntt> Transmission system for facsimile signal storage
JPS5470365U (enrdf_load_stackoverflow) * 1977-10-26 1979-05-18
US4539582A (en) * 1980-06-10 1985-09-03 Tokyo Shibaura Denki Kabushiki Kaisha Anti-short bonding pad structure

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