JPS5028749A - - Google Patents
Info
- Publication number
- JPS5028749A JPS5028749A JP7833173A JP7833173A JPS5028749A JP S5028749 A JPS5028749 A JP S5028749A JP 7833173 A JP7833173 A JP 7833173A JP 7833173 A JP7833173 A JP 7833173A JP S5028749 A JPS5028749 A JP S5028749A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7833173A JPS5028749A (de) | 1973-07-13 | 1973-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7833173A JPS5028749A (de) | 1973-07-13 | 1973-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5028749A true JPS5028749A (de) | 1975-03-24 |
Family
ID=13658976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7833173A Pending JPS5028749A (de) | 1973-07-13 | 1973-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5028749A (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5331961A (en) * | 1976-09-03 | 1978-03-25 | Philips Nv | Method of making semiconductor |
| US6805808B2 (en) | 2000-09-14 | 2004-10-19 | Sumitomo Electric Industries, Ltd. | Method for separating chips from diamond wafer |
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1973
- 1973-07-13 JP JP7833173A patent/JPS5028749A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5331961A (en) * | 1976-09-03 | 1978-03-25 | Philips Nv | Method of making semiconductor |
| US6805808B2 (en) | 2000-09-14 | 2004-10-19 | Sumitomo Electric Industries, Ltd. | Method for separating chips from diamond wafer |