JPS5028237U - - Google Patents
Info
- Publication number
- JPS5028237U JPS5028237U JP7984773U JP7984773U JPS5028237U JP S5028237 U JPS5028237 U JP S5028237U JP 7984773 U JP7984773 U JP 7984773U JP 7984773 U JP7984773 U JP 7984773U JP S5028237 U JPS5028237 U JP S5028237U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7984773U JPS5028237U (fr) | 1973-07-05 | 1973-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7984773U JPS5028237U (fr) | 1973-07-05 | 1973-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5028237U true JPS5028237U (fr) | 1975-04-01 |
Family
ID=28256857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7984773U Pending JPS5028237U (fr) | 1973-07-05 | 1973-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5028237U (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6395540U (fr) * | 1986-12-11 | 1988-06-20 | ||
| JPS63103543U (fr) * | 1986-12-23 | 1988-07-05 | ||
| JP2016517176A (ja) * | 2013-05-14 | 2016-06-09 | ▲華▼▲為▼終端有限公司Ｈｕａｗｅｉ Ｄｅｖｉｃｅ Ｃｏ．， Ｌｔｄ． | 電子機器筐体および電子機器 |
| JP2019009165A (ja) * | 2017-06-21 | 2019-01-17 | Ｎｅｃプラットフォームズ株式会社 | 熱拡散構造及びそれを備えた電子機器 |
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1973
- 1973-07-05 JP JP7984773U patent/JPS5028237U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6395540U (fr) * | 1986-12-11 | 1988-06-20 | ||
| JPS63103543U (fr) * | 1986-12-23 | 1988-07-05 | ||
| JP2016517176A (ja) * | 2013-05-14 | 2016-06-09 | ▲華▼▲為▼終端有限公司Ｈｕａｗｅｉ Ｄｅｖｉｃｅ Ｃｏ．， Ｌｔｄ． | 電子機器筐体および電子機器 |
| US9967987B2 (en) | 2013-05-14 | 2018-05-08 | Huawei Device Co., Ltd. | Electronic device enclosure and electronic device |
| JP2019009165A (ja) * | 2017-06-21 | 2019-01-17 | Ｎｅｃプラットフォームズ株式会社 | 熱拡散構造及びそれを備えた電子機器 |