JPS5027775U - - Google Patents

Info

Publication number
JPS5027775U
JPS5027775U JP7959273U JP7959273U JPS5027775U JP S5027775 U JPS5027775 U JP S5027775U JP 7959273 U JP7959273 U JP 7959273U JP 7959273 U JP7959273 U JP 7959273U JP S5027775 U JPS5027775 U JP S5027775U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7959273U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7959273U priority Critical patent/JPS5027775U/ja
Publication of JPS5027775U publication Critical patent/JPS5027775U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP7959273U 1973-07-04 1973-07-04 Pending JPS5027775U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7959273U JPS5027775U (ja) 1973-07-04 1973-07-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7959273U JPS5027775U (ja) 1973-07-04 1973-07-04

Publications (1)

Publication Number Publication Date
JPS5027775U true JPS5027775U (ja) 1975-03-31

Family

ID=28256390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7959273U Pending JPS5027775U (ja) 1973-07-04 1973-07-04

Country Status (1)

Country Link
JP (1) JPS5027775U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04167380A (ja) * 1990-10-30 1992-06-15 Nissan Motor Co Ltd 半導体装置
JP2004006912A (ja) * 2003-06-09 2004-01-08 Rabo Sufia Kk 光学媒体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04167380A (ja) * 1990-10-30 1992-06-15 Nissan Motor Co Ltd 半導体装置
JP2004006912A (ja) * 2003-06-09 2004-01-08 Rabo Sufia Kk 光学媒体

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