JPS502740A - - Google Patents

Info

Publication number
JPS502740A
JPS502740A JP48052295A JP5229573A JPS502740A JP S502740 A JPS502740 A JP S502740A JP 48052295 A JP48052295 A JP 48052295A JP 5229573 A JP5229573 A JP 5229573A JP S502740 A JPS502740 A JP S502740A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48052295A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48052295A priority Critical patent/JPS502740A/ja
Publication of JPS502740A publication Critical patent/JPS502740A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Coating Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP48052295A 1973-05-11 1973-05-11 Pending JPS502740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48052295A JPS502740A (ja) 1973-05-11 1973-05-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48052295A JPS502740A (ja) 1973-05-11 1973-05-11

Publications (1)

Publication Number Publication Date
JPS502740A true JPS502740A (ja) 1975-01-13

Family

ID=12910795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48052295A Pending JPS502740A (ja) 1973-05-11 1973-05-11

Country Status (1)

Country Link
JP (1) JPS502740A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314748A (en) * 1976-07-26 1978-02-09 Matsushita Electric Ind Co Ltd Micro extrusion devices
JPS53113045A (en) * 1977-03-09 1978-10-03 Nissin Food Products Ltd Improving of quality of wheat flour
JPS63189A (ja) * 1986-06-19 1988-01-05 日本システムハウス株式会社 配線方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314748A (en) * 1976-07-26 1978-02-09 Matsushita Electric Ind Co Ltd Micro extrusion devices
JPS53113045A (en) * 1977-03-09 1978-10-03 Nissin Food Products Ltd Improving of quality of wheat flour
JPS63189A (ja) * 1986-06-19 1988-01-05 日本システムハウス株式会社 配線方法

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