JPS5026296Y1 - - Google Patents

Info

Publication number
JPS5026296Y1
JPS5026296Y1 JP1968094764U JP9476468U JPS5026296Y1 JP S5026296 Y1 JPS5026296 Y1 JP S5026296Y1 JP 1968094764 U JP1968094764 U JP 1968094764U JP 9476468 U JP9476468 U JP 9476468U JP S5026296 Y1 JPS5026296 Y1 JP S5026296Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1968094764U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1968094764U priority Critical patent/JPS5026296Y1/ja
Publication of JPS5026296Y1 publication Critical patent/JPS5026296Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
JP1968094764U 1968-10-30 1968-10-30 Expired JPS5026296Y1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1968094764U JPS5026296Y1 (ja) 1968-10-30 1968-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1968094764U JPS5026296Y1 (ja) 1968-10-30 1968-10-30

Publications (1)

Publication Number Publication Date
JPS5026296Y1 true JPS5026296Y1 (ja) 1975-08-06

Family

ID=33073967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1968094764U Expired JPS5026296Y1 (ja) 1968-10-30 1968-10-30

Country Status (1)

Country Link
JP (1) JPS5026296Y1 (ja)

Similar Documents

Publication Publication Date Title
AU1946070A (ja)
AU428130B2 (ja)
AU2374870A (ja)
AU5184069A (ja)
AU6168869A (ja)
AU6171569A (ja)
AU429879B2 (ja)
AU416157B2 (ja)
AU2581067A (ja)
AU4811568A (ja)
AU421558B1 (ja)
AU4744468A (ja)
AU3789668A (ja)
AU3224368A (ja)
AU2580267A (ja)
AR203075Q (ja)
AU479393A (ja)
BE708888A (ja)
AU463027A (ja)
AU4503667A (ja)
AU4464266A (ja)
AU479894A (ja)
AU4270368A (ja)
AU4224469A (ja)
AU3083868A (ja)