JPS5025978U - - Google Patents
Info
- Publication number
- JPS5025978U JPS5025978U JP8216473U JP8216473U JPS5025978U JP S5025978 U JPS5025978 U JP S5025978U JP 8216473 U JP8216473 U JP 8216473U JP 8216473 U JP8216473 U JP 8216473U JP S5025978 U JPS5025978 U JP S5025978U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Buffer Packaging (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8216473U JPS5025978U (en) | 1973-07-10 | 1973-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8216473U JPS5025978U (en) | 1973-07-10 | 1973-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5025978U true JPS5025978U (en) | 1975-03-25 |
Family
ID=28261268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8216473U Pending JPS5025978U (en) | 1973-07-10 | 1973-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5025978U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51129165U (en) * | 1975-03-31 | 1976-10-19 | ||
| JPS5832699U (en) * | 1981-08-26 | 1983-03-03 | 藤森工業株式会社 | Cushioning materials for electronic equipment parts |
| JP2010025189A (en) * | 2008-07-17 | 2010-02-04 | Uchiyama Corporation Kk | Pipe support material and pipe support structure using the same |
| JP2016210490A (en) * | 2015-05-13 | 2016-12-15 | パナソニックＩｐマネジメント株式会社 | Packing material |
-
1973
- 1973-07-10 JP JP8216473U patent/JPS5025978U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51129165U (en) * | 1975-03-31 | 1976-10-19 | ||
| JPS5832699U (en) * | 1981-08-26 | 1983-03-03 | 藤森工業株式会社 | Cushioning materials for electronic equipment parts |
| JP2010025189A (en) * | 2008-07-17 | 2010-02-04 | Uchiyama Corporation Kk | Pipe support material and pipe support structure using the same |
| JP2016210490A (en) * | 2015-05-13 | 2016-12-15 | パナソニックＩｐマネジメント株式会社 | Packing material |