JPS5024076A - - Google Patents
Info
- Publication number
- JPS5024076A JPS5024076A JP48076031A JP7603173A JPS5024076A JP S5024076 A JPS5024076 A JP S5024076A JP 48076031 A JP48076031 A JP 48076031A JP 7603173 A JP7603173 A JP 7603173A JP S5024076 A JPS5024076 A JP S5024076A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/0711—
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- H10W72/075—
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- H10W72/07521—
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- H10W72/50—
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- H10W72/5363—
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- H10W72/5449—
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- H10W90/753—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48076031A JPS5024076A (ja) | 1973-07-05 | 1973-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48076031A JPS5024076A (ja) | 1973-07-05 | 1973-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5024076A true JPS5024076A (ja) | 1975-03-14 |
Family
ID=13593440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48076031A Pending JPS5024076A (ja) | 1973-07-05 | 1973-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5024076A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5489478A (en) * | 1977-12-27 | 1979-07-16 | Toshiba Corp | Semiconductor device and production of the same |
| JPS54152962A (en) * | 1978-05-24 | 1979-12-01 | Hitachi Ltd | Ultrasonic wire-bonding unit |
| JPS57111037A (en) * | 1980-12-27 | 1982-07-10 | Tokyo Sokuhan Kk | Ultrasonic wire bonding method and its device |
-
1973
- 1973-07-05 JP JP48076031A patent/JPS5024076A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5489478A (en) * | 1977-12-27 | 1979-07-16 | Toshiba Corp | Semiconductor device and production of the same |
| JPS54152962A (en) * | 1978-05-24 | 1979-12-01 | Hitachi Ltd | Ultrasonic wire-bonding unit |
| JPS57111037A (en) * | 1980-12-27 | 1982-07-10 | Tokyo Sokuhan Kk | Ultrasonic wire bonding method and its device |