JPS5023274B1 - - Google Patents
Info
- Publication number
- JPS5023274B1 JPS5023274B1 JP44087569A JP8756969A JPS5023274B1 JP S5023274 B1 JPS5023274 B1 JP S5023274B1 JP 44087569 A JP44087569 A JP 44087569A JP 8756969 A JP8756969 A JP 8756969A JP S5023274 B1 JPS5023274 B1 JP S5023274B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44087569A JPS5023274B1 (ja) | 1969-11-04 | 1969-11-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP44087569A JPS5023274B1 (ja) | 1969-11-04 | 1969-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5023274B1 true JPS5023274B1 (ja) | 1975-08-06 |
Family
ID=13918615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP44087569A Pending JPS5023274B1 (ja) | 1969-11-04 | 1969-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5023274B1 (ja) |
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1969
- 1969-11-04 JP JP44087569A patent/JPS5023274B1/ja active Pending