JPS5021834B1 - - Google Patents
Info
- Publication number
- JPS5021834B1 JPS5021834B1 JP43035006A JP3500668A JPS5021834B1 JP S5021834 B1 JPS5021834 B1 JP S5021834B1 JP 43035006 A JP43035006 A JP 43035006A JP 3500668 A JP3500668 A JP 3500668A JP S5021834 B1 JPS5021834 B1 JP S5021834B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/211—Design considerations for internal polarisation
- H10D89/311—Design considerations for internal polarisation in bipolar devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/031—Manufacture or treatment of isolation regions comprising PN junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/30—Isolation regions comprising PN junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W15/00—Highly-doped buried regions of integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W15/00—Highly-doped buried regions of integrated devices
- H10W15/01—Manufacture or treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/037—Diffusion-deposition
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/145—Shaped junctions
Landscapes
- Element Separation (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DET0033927 | 1967-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5021834B1 true JPS5021834B1 (enExample) | 1975-07-25 |
Family
ID=7558123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP43035006A Pending JPS5021834B1 (enExample) | 1967-05-24 | 1968-05-23 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3639814A (enExample) |
| JP (1) | JPS5021834B1 (enExample) |
| FR (1) | FR1565994A (enExample) |
| GB (1) | GB1219660A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3769105A (en) * | 1970-01-26 | 1973-10-30 | Ibm | Process for making an integrated circuit with a damping resistor in combination with a buried decoupling capacitor |
| US3808475A (en) * | 1972-07-10 | 1974-04-30 | Amdahl Corp | Lsi chip construction and method |
| US4017885A (en) * | 1973-10-25 | 1977-04-12 | Texas Instruments Incorporated | Large value capacitor |
| US3969750A (en) * | 1974-02-12 | 1976-07-13 | International Business Machines Corporation | Diffused junction capacitor and process for producing the same |
| DE3740302A1 (de) * | 1987-11-27 | 1989-06-08 | Telefunken Electronic Gmbh | Integrierte schaltungsanordnung |
| US5059897A (en) * | 1989-12-07 | 1991-10-22 | Texas Instruments Incorporated | Method and apparatus for testing passive substrates for integrated circuit mounting |
| US6368514B1 (en) | 1999-09-01 | 2002-04-09 | Luminous Intent, Inc. | Method and apparatus for batch processed capacitors using masking techniques |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1073551A (en) * | 1964-07-02 | 1967-06-28 | Westinghouse Electric Corp | Integrated circuit comprising a diode and method of making the same |
| US3411052A (en) * | 1965-10-28 | 1968-11-12 | Ncr Co | Logical circuit arrangement having a constant current gain for controlled operation i saturation |
| US3538397A (en) * | 1967-05-09 | 1970-11-03 | Motorola Inc | Distributed semiconductor power supplies and decoupling capacitor therefor |
| US3456166A (en) * | 1967-05-11 | 1969-07-15 | Teledyne Inc | Junction capacitor |
| US3460010A (en) * | 1968-05-15 | 1969-08-05 | Ibm | Thin film decoupling capacitor incorporated in an integrated circuit chip,and process for making same |
-
1968
- 1968-05-20 US US730284A patent/US3639814A/en not_active Expired - Lifetime
- 1968-05-21 FR FR1565994D patent/FR1565994A/fr not_active Expired
- 1968-05-23 JP JP43035006A patent/JPS5021834B1/ja active Pending
- 1968-05-24 GB GB24949/68A patent/GB1219660A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1614816B2 (de) | 1974-10-03 |
| GB1219660A (en) | 1971-01-20 |
| DE1614816A1 (de) | 1970-12-23 |
| US3639814A (en) | 1972-02-01 |
| FR1565994A (enExample) | 1969-05-02 |