JPS5021674A - - Google Patents
Info
- Publication number
- JPS5021674A JPS5021674A JP7075273A JP7075273A JPS5021674A JP S5021674 A JPS5021674 A JP S5021674A JP 7075273 A JP7075273 A JP 7075273A JP 7075273 A JP7075273 A JP 7075273A JP S5021674 A JPS5021674 A JP S5021674A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7075273A JPS5021674A (pl) | 1973-06-25 | 1973-06-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7075273A JPS5021674A (pl) | 1973-06-25 | 1973-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5021674A true JPS5021674A (pl) | 1975-03-07 |
Family
ID=13440546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7075273A Pending JPS5021674A (pl) | 1973-06-25 | 1973-06-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5021674A (pl) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52113158A (en) * | 1976-03-19 | 1977-09-22 | Hitachi Ltd | Connection of semiconductor leads |
JPS5351960U (pl) * | 1976-10-05 | 1978-05-02 | ||
JPS5496568U (pl) * | 1977-12-21 | 1979-07-07 | ||
JPS61256787A (ja) * | 1985-05-10 | 1986-11-14 | 株式会社日立製作所 | 回路基板の接続構造 |
JPS6239322U (pl) * | 1985-08-28 | 1987-03-09 |
-
1973
- 1973-06-25 JP JP7075273A patent/JPS5021674A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52113158A (en) * | 1976-03-19 | 1977-09-22 | Hitachi Ltd | Connection of semiconductor leads |
JPS5351960U (pl) * | 1976-10-05 | 1978-05-02 | ||
JPS5496568U (pl) * | 1977-12-21 | 1979-07-07 | ||
JPS61256787A (ja) * | 1985-05-10 | 1986-11-14 | 株式会社日立製作所 | 回路基板の接続構造 |
JPS6239322U (pl) * | 1985-08-28 | 1987-03-09 |