JPS5021449U - - Google Patents
Info
- Publication number
- JPS5021449U JPS5021449U JP7488773U JP7488773U JPS5021449U JP S5021449 U JPS5021449 U JP S5021449U JP 7488773 U JP7488773 U JP 7488773U JP 7488773 U JP7488773 U JP 7488773U JP S5021449 U JPS5021449 U JP S5021449U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7488773U JPS5021449U (enExample) | 1973-06-23 | 1973-06-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7488773U JPS5021449U (enExample) | 1973-06-23 | 1973-06-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5021449U true JPS5021449U (enExample) | 1975-03-11 |
Family
ID=28247522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7488773U Pending JPS5021449U (enExample) | 1973-06-23 | 1973-06-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5021449U (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53126719U (enExample) * | 1977-03-14 | 1978-10-07 | ||
| JPS56159253U (enExample) * | 1980-04-28 | 1981-11-27 | ||
| JPS56171250U (enExample) * | 1980-05-23 | 1981-12-17 | ||
| JPS59157846U (ja) * | 1983-04-07 | 1984-10-23 | 有限会社 吹田印材製作所 | 合わせ印板 |
| JPS61206466U (enExample) * | 1985-06-17 | 1986-12-26 |
-
1973
- 1973-06-23 JP JP7488773U patent/JPS5021449U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53126719U (enExample) * | 1977-03-14 | 1978-10-07 | ||
| JPS56159253U (enExample) * | 1980-04-28 | 1981-11-27 | ||
| JPS56171250U (enExample) * | 1980-05-23 | 1981-12-17 | ||
| JPS59157846U (ja) * | 1983-04-07 | 1984-10-23 | 有限会社 吹田印材製作所 | 合わせ印板 |
| JPS61206466U (enExample) * | 1985-06-17 | 1986-12-26 |