JPS5021339B1 - - Google Patents

Info

Publication number
JPS5021339B1
JPS5021339B1 JP45074392A JP7439270A JPS5021339B1 JP S5021339 B1 JPS5021339 B1 JP S5021339B1 JP 45074392 A JP45074392 A JP 45074392A JP 7439270 A JP7439270 A JP 7439270A JP S5021339 B1 JPS5021339 B1 JP S5021339B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45074392A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45074392A priority Critical patent/JPS5021339B1/ja
Publication of JPS5021339B1 publication Critical patent/JPS5021339B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP45074392A 1970-08-24 1970-08-24 Pending JPS5021339B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP45074392A JPS5021339B1 (ja) 1970-08-24 1970-08-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45074392A JPS5021339B1 (ja) 1970-08-24 1970-08-24

Publications (1)

Publication Number Publication Date
JPS5021339B1 true JPS5021339B1 (ja) 1975-07-22

Family

ID=13545847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45074392A Pending JPS5021339B1 (ja) 1970-08-24 1970-08-24

Country Status (1)

Country Link
JP (1) JPS5021339B1 (ja)

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