JPS5020665A - - Google Patents
Info
- Publication number
- JPS5020665A JPS5020665A JP48070530A JP7053073A JPS5020665A JP S5020665 A JPS5020665 A JP S5020665A JP 48070530 A JP48070530 A JP 48070530A JP 7053073 A JP7053073 A JP 7053073A JP S5020665 A JPS5020665 A JP S5020665A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
- H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/10125—Reinforcing structures
- H01L2224/10126—Bump collar
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48070530A JPS5020665A (cs) | 1973-06-22 | 1973-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48070530A JPS5020665A (cs) | 1973-06-22 | 1973-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5020665A true JPS5020665A (cs) | 1975-03-05 |
Family
ID=13434168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48070530A Pending JPS5020665A (cs) | 1973-06-22 | 1973-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5020665A (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4854381A (cs) * | 1971-11-13 | 1973-07-31 | ||
| JPS5113821B1 (cs) * | 1969-02-22 | 1976-05-04 | ||
| JPS5826664A (ja) * | 1981-08-06 | 1983-02-17 | Rizumu Jidosha Buhin Seizo Kk | 液圧制御弁 |
-
1973
- 1973-06-22 JP JP48070530A patent/JPS5020665A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113821B1 (cs) * | 1969-02-22 | 1976-05-04 | ||
| JPS4854381A (cs) * | 1971-11-13 | 1973-07-31 | ||
| JPS5826664A (ja) * | 1981-08-06 | 1983-02-17 | Rizumu Jidosha Buhin Seizo Kk | 液圧制御弁 |