JPS5019366A - - Google Patents

Info

Publication number
JPS5019366A
JPS5019366A JP49053806A JP5380674A JPS5019366A JP S5019366 A JPS5019366 A JP S5019366A JP 49053806 A JP49053806 A JP 49053806A JP 5380674 A JP5380674 A JP 5380674A JP S5019366 A JPS5019366 A JP S5019366A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49053806A
Other languages
Japanese (ja)
Other versions
JPS5421074B2 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19732324370 external-priority patent/DE2324370C3/de
Application filed filed Critical
Publication of JPS5019366A publication Critical patent/JPS5019366A/ja
Publication of JPS5421074B2 publication Critical patent/JPS5421074B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611Bolts or screws
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/231Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/60Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625Clamping parts not primarily conducting heat

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP5380674A 1973-05-14 1974-05-14 Expired JPS5421074B2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732324370 DE2324370C3 (de) 1973-05-14 Halbleiterbaustein

Publications (2)

Publication Number Publication Date
JPS5019366A true JPS5019366A (de) 1975-02-28
JPS5421074B2 JPS5421074B2 (de) 1979-07-27

Family

ID=5880926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5380674A Expired JPS5421074B2 (de) 1973-05-14 1974-05-14

Country Status (7)

Country Link
JP (1) JPS5421074B2 (de)
AT (1) AT327323B (de)
BE (1) BE814391A (de)
CH (1) CH570701A5 (de)
FR (1) FR2230077B3 (de)
NL (1) NL7406110A (de)
ZA (1) ZA742941B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3215192A1 (de) * 1982-04-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente

Also Published As

Publication number Publication date
FR2230077B3 (de) 1977-03-11
BE814391A (fr) 1974-08-16
AT327323B (de) 1976-01-26
DE2324370B2 (de) 1975-12-11
JPS5421074B2 (de) 1979-07-27
CH570701A5 (de) 1975-12-15
ZA742941B (en) 1975-05-28
NL7406110A (de) 1974-11-18
FR2230077A1 (de) 1974-12-13
DE2324370A1 (de) 1974-11-28
ATA361674A (de) 1975-04-15

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