JPS501786A - - Google Patents
Info
- Publication number
- JPS501786A JPS501786A JP4846073A JP4846073A JPS501786A JP S501786 A JPS501786 A JP S501786A JP 4846073 A JP4846073 A JP 4846073A JP 4846073 A JP4846073 A JP 4846073A JP S501786 A JPS501786 A JP S501786A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4846073A JPS501786A (cs) | 1973-05-02 | 1973-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4846073A JPS501786A (cs) | 1973-05-02 | 1973-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS501786A true JPS501786A (cs) | 1975-01-09 |
Family
ID=12803963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4846073A Pending JPS501786A (cs) | 1973-05-02 | 1973-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS501786A (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519900A (en) * | 1978-07-26 | 1980-02-12 | Nat Semiconductor Corp | Method of manufacturing composite tape with bump for automatically bonding semiconductor device |
| JP2006186229A (ja) * | 2004-12-28 | 2006-07-13 | Mitsui High Tec Inc | リードフレーム及びこれを用いた半導体装置 |
-
1973
- 1973-05-02 JP JP4846073A patent/JPS501786A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519900A (en) * | 1978-07-26 | 1980-02-12 | Nat Semiconductor Corp | Method of manufacturing composite tape with bump for automatically bonding semiconductor device |
| JP2006186229A (ja) * | 2004-12-28 | 2006-07-13 | Mitsui High Tec Inc | リードフレーム及びこれを用いた半導体装置 |