JPS501656A - - Google Patents

Info

Publication number
JPS501656A
JPS501656A JP48049743A JP4974373A JPS501656A JP S501656 A JPS501656 A JP S501656A JP 48049743 A JP48049743 A JP 48049743A JP 4974373 A JP4974373 A JP 4974373A JP S501656 A JPS501656 A JP S501656A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48049743A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48049743A priority Critical patent/JPS501656A/ja
Publication of JPS501656A publication Critical patent/JPS501656A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP48049743A 1973-05-07 1973-05-07 Pending JPS501656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48049743A JPS501656A (ja) 1973-05-07 1973-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48049743A JPS501656A (ja) 1973-05-07 1973-05-07

Publications (1)

Publication Number Publication Date
JPS501656A true JPS501656A (ja) 1975-01-09

Family

ID=12839654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48049743A Pending JPS501656A (ja) 1973-05-07 1973-05-07

Country Status (1)

Country Link
JP (1) JPS501656A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5589824U (ja) * 1978-12-14 1980-06-21
JPS5589825U (ja) * 1978-12-14 1980-06-21
JPS56129618U (ja) * 1980-03-03 1981-10-02

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5589824U (ja) * 1978-12-14 1980-06-21
JPS5589825U (ja) * 1978-12-14 1980-06-21
JPS5634182Y2 (ja) * 1978-12-14 1981-08-13
JPS5811947Y2 (ja) * 1978-12-14 1983-03-07 臼井国際産業株式会社 感速作動流体接手
JPS56129618U (ja) * 1980-03-03 1981-10-02

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