JPS501656A - - Google Patents

Info

Publication number
JPS501656A
JPS501656A JP48049743A JP4974373A JPS501656A JP S501656 A JPS501656 A JP S501656A JP 48049743 A JP48049743 A JP 48049743A JP 4974373 A JP4974373 A JP 4974373A JP S501656 A JPS501656 A JP S501656A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48049743A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48049743A priority Critical patent/JPS501656A/ja
Publication of JPS501656A publication Critical patent/JPS501656A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP48049743A 1973-05-07 1973-05-07 Pending JPS501656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48049743A JPS501656A (ja) 1973-05-07 1973-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48049743A JPS501656A (ja) 1973-05-07 1973-05-07

Publications (1)

Publication Number Publication Date
JPS501656A true JPS501656A (ja) 1975-01-09

Family

ID=12839654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48049743A Pending JPS501656A (ja) 1973-05-07 1973-05-07

Country Status (1)

Country Link
JP (1) JPS501656A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5589825U (ja) * 1978-12-14 1980-06-21
JPS5589824U (ja) * 1978-12-14 1980-06-21
JPS56129618U (ja) * 1980-03-03 1981-10-02

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5589825U (ja) * 1978-12-14 1980-06-21
JPS5589824U (ja) * 1978-12-14 1980-06-21
JPS56129618U (ja) * 1980-03-03 1981-10-02

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