JPS50156874A - - Google Patents
Info
- Publication number
- JPS50156874A JPS50156874A JP6438874A JP6438874A JPS50156874A JP S50156874 A JPS50156874 A JP S50156874A JP 6438874 A JP6438874 A JP 6438874A JP 6438874 A JP6438874 A JP 6438874A JP S50156874 A JPS50156874 A JP S50156874A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6438874A JPS50156874A (US06272168-20010807-M00014.png) | 1974-06-06 | 1974-06-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6438874A JPS50156874A (US06272168-20010807-M00014.png) | 1974-06-06 | 1974-06-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50156874A true JPS50156874A (US06272168-20010807-M00014.png) | 1975-12-18 |
Family
ID=13256876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6438874A Pending JPS50156874A (US06272168-20010807-M00014.png) | 1974-06-06 | 1974-06-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50156874A (US06272168-20010807-M00014.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5423563U (US06272168-20010807-M00014.png) * | 1977-07-18 | 1979-02-16 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4918591U (US06272168-20010807-M00014.png) * | 1972-05-19 | 1974-02-16 |
-
1974
- 1974-06-06 JP JP6438874A patent/JPS50156874A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4918591U (US06272168-20010807-M00014.png) * | 1972-05-19 | 1974-02-16 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5423563U (US06272168-20010807-M00014.png) * | 1977-07-18 | 1979-02-16 | ||
JPS5826525Y2 (ja) * | 1977-07-18 | 1983-06-08 | 日本電気株式会社 | 半導体装置 |