JPS50150365A - - Google Patents
Info
- Publication number
- JPS50150365A JPS50150365A JP49056490A JP5649074A JPS50150365A JP S50150365 A JPS50150365 A JP S50150365A JP 49056490 A JP49056490 A JP 49056490A JP 5649074 A JP5649074 A JP 5649074A JP S50150365 A JPS50150365 A JP S50150365A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49056490A JPS50150365A (en) | 1974-05-22 | 1974-05-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49056490A JPS50150365A (en) | 1974-05-22 | 1974-05-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50150365A true JPS50150365A (en) | 1975-12-02 |
Family
ID=13028524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49056490A Pending JPS50150365A (en) | 1974-05-22 | 1974-05-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50150365A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115835A (en) * | 1981-12-28 | 1983-07-09 | Fujitsu Ltd | Formation of buried wirings of semiconductor device |
JPS58197751A (en) * | 1982-05-13 | 1983-11-17 | Mitsubishi Electric Corp | Formation of salient electrode |
JPS58219749A (en) * | 1982-06-15 | 1983-12-21 | Rhythm Watch Co Ltd | Formation of solder bump for semiconductor substrate |
-
1974
- 1974-05-22 JP JP49056490A patent/JPS50150365A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115835A (en) * | 1981-12-28 | 1983-07-09 | Fujitsu Ltd | Formation of buried wirings of semiconductor device |
JPH0440858B2 (en) * | 1981-12-28 | 1992-07-06 | Fujitsu Ltd | |
JPS58197751A (en) * | 1982-05-13 | 1983-11-17 | Mitsubishi Electric Corp | Formation of salient electrode |
JPS58219749A (en) * | 1982-06-15 | 1983-12-21 | Rhythm Watch Co Ltd | Formation of solder bump for semiconductor substrate |