JPS50150262U - - Google Patents

Info

Publication number
JPS50150262U
JPS50150262U JP1974062006U JP6200674U JPS50150262U JP S50150262 U JPS50150262 U JP S50150262U JP 1974062006 U JP1974062006 U JP 1974062006U JP 6200674 U JP6200674 U JP 6200674U JP S50150262 U JPS50150262 U JP S50150262U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1974062006U
Other languages
Japanese (ja)
Other versions
JPS5433830Y2 (ref
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974062006U priority Critical patent/JPS5433830Y2/ja
Publication of JPS50150262U publication Critical patent/JPS50150262U/ja
Application granted granted Critical
Publication of JPS5433830Y2 publication Critical patent/JPS5433830Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Wire Bonding (AREA)
JP1974062006U 1974-05-31 1974-05-31 Expired JPS5433830Y2 (ref)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974062006U JPS5433830Y2 (ref) 1974-05-31 1974-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974062006U JPS5433830Y2 (ref) 1974-05-31 1974-05-31

Publications (2)

Publication Number Publication Date
JPS50150262U true JPS50150262U (ref) 1975-12-13
JPS5433830Y2 JPS5433830Y2 (ref) 1979-10-17

Family

ID=28223065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974062006U Expired JPS5433830Y2 (ref) 1974-05-31 1974-05-31

Country Status (1)

Country Link
JP (1) JPS5433830Y2 (ref)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938575A (ref) * 1972-07-10 1974-04-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938575A (ref) * 1972-07-10 1974-04-10

Also Published As

Publication number Publication date
JPS5433830Y2 (ref) 1979-10-17

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