JPS50150262U - - Google Patents

Info

Publication number
JPS50150262U
JPS50150262U JP1974062006U JP6200674U JPS50150262U JP S50150262 U JPS50150262 U JP S50150262U JP 1974062006 U JP1974062006 U JP 1974062006U JP 6200674 U JP6200674 U JP 6200674U JP S50150262 U JPS50150262 U JP S50150262U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1974062006U
Other languages
Japanese (ja)
Other versions
JPS5433830Y2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974062006U priority Critical patent/JPS5433830Y2/ja
Publication of JPS50150262U publication Critical patent/JPS50150262U/ja
Application granted granted Critical
Publication of JPS5433830Y2 publication Critical patent/JPS5433830Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Wire Bonding (AREA)
JP1974062006U 1974-05-31 1974-05-31 Expired JPS5433830Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974062006U JPS5433830Y2 (en:Method) 1974-05-31 1974-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974062006U JPS5433830Y2 (en:Method) 1974-05-31 1974-05-31

Publications (2)

Publication Number Publication Date
JPS50150262U true JPS50150262U (en:Method) 1975-12-13
JPS5433830Y2 JPS5433830Y2 (en:Method) 1979-10-17

Family

ID=28223065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974062006U Expired JPS5433830Y2 (en:Method) 1974-05-31 1974-05-31

Country Status (1)

Country Link
JP (1) JPS5433830Y2 (en:Method)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938575A (en:Method) * 1972-07-10 1974-04-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4938575A (en:Method) * 1972-07-10 1974-04-10

Also Published As

Publication number Publication date
JPS5433830Y2 (en:Method) 1979-10-17

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