JPS50144758A - - Google Patents
Info
- Publication number
- JPS50144758A JPS50144758A JP1553975A JP1553975A JPS50144758A JP S50144758 A JPS50144758 A JP S50144758A JP 1553975 A JP1553975 A JP 1553975A JP 1553975 A JP1553975 A JP 1553975A JP S50144758 A JPS50144758 A JP S50144758A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulding By Coating Moulds (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46878374A | 1974-05-09 | 1974-05-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50144758A true JPS50144758A (en) | 1975-11-20 |
Family
ID=23861228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1553975A Pending JPS50144758A (en) | 1974-05-09 | 1975-02-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50144758A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4999319A (en) * | 1986-03-19 | 1991-03-12 | Fujitsu Limited | Method of manufacturing semiconductor device having package structure |
-
1975
- 1975-02-07 JP JP1553975A patent/JPS50144758A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4999319A (en) * | 1986-03-19 | 1991-03-12 | Fujitsu Limited | Method of manufacturing semiconductor device having package structure |