JPS50141975A - - Google Patents

Info

Publication number
JPS50141975A
JPS50141975A JP4896574A JP4896574A JPS50141975A JP S50141975 A JPS50141975 A JP S50141975A JP 4896574 A JP4896574 A JP 4896574A JP 4896574 A JP4896574 A JP 4896574A JP S50141975 A JPS50141975 A JP S50141975A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4896574A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4896574A priority Critical patent/JPS50141975A/ja
Publication of JPS50141975A publication Critical patent/JPS50141975A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05541—Structure
    • H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP4896574A 1974-05-01 1974-05-01 Pending JPS50141975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4896574A JPS50141975A (en) 1974-05-01 1974-05-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4896574A JPS50141975A (en) 1974-05-01 1974-05-01

Publications (1)

Publication Number Publication Date
JPS50141975A true JPS50141975A (en) 1975-11-15

Family

ID=12817981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4896574A Pending JPS50141975A (en) 1974-05-01 1974-05-01

Country Status (1)

Country Link
JP (1) JPS50141975A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785242A (en) * 1980-11-18 1982-05-27 Mitsubishi Electric Corp Semiconductor device
JPS5787145A (en) * 1980-11-20 1982-05-31 Seiko Epson Corp Semiconductor device
JPS58213450A (en) * 1982-06-04 1983-12-12 Toshiba Corp Structure of multilayer wiring of semiconductor device
JPS59181041A (en) * 1983-03-31 1984-10-15 Toshiba Corp Semiconductor integrated circuit device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785242A (en) * 1980-11-18 1982-05-27 Mitsubishi Electric Corp Semiconductor device
JPS5787145A (en) * 1980-11-20 1982-05-31 Seiko Epson Corp Semiconductor device
JPS58213450A (en) * 1982-06-04 1983-12-12 Toshiba Corp Structure of multilayer wiring of semiconductor device
JPS6343895B2 (en) * 1982-06-04 1988-09-01 Tokyo Shibaura Electric Co
JPS59181041A (en) * 1983-03-31 1984-10-15 Toshiba Corp Semiconductor integrated circuit device

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