JPS50141519A - - Google Patents
Info
- Publication number
- JPS50141519A JPS50141519A JP4833774A JP4833774A JPS50141519A JP S50141519 A JPS50141519 A JP S50141519A JP 4833774 A JP4833774 A JP 4833774A JP 4833774 A JP4833774 A JP 4833774A JP S50141519 A JPS50141519 A JP S50141519A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4833774A JPS5321361B2 (enExample) | 1974-05-01 | 1974-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4833774A JPS5321361B2 (enExample) | 1974-05-01 | 1974-05-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50141519A true JPS50141519A (enExample) | 1975-11-14 |
| JPS5321361B2 JPS5321361B2 (enExample) | 1978-07-03 |
Family
ID=12800581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4833774A Expired JPS5321361B2 (enExample) | 1974-05-01 | 1974-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5321361B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410611A (zh) * | 2020-11-10 | 2021-02-26 | 北京中超伟业信息安全技术股份有限公司 | 一种用于安全加密芯片引线框架的铜合金板材及其制备方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5583811U (enExample) * | 1978-12-07 | 1980-06-10 |
-
1974
- 1974-05-01 JP JP4833774A patent/JPS5321361B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112410611A (zh) * | 2020-11-10 | 2021-02-26 | 北京中超伟业信息安全技术股份有限公司 | 一种用于安全加密芯片引线框架的铜合金板材及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5321361B2 (enExample) | 1978-07-03 |