JPS50140063A - - Google Patents
Info
- Publication number
- JPS50140063A JPS50140063A JP49047348A JP4734874A JPS50140063A JP S50140063 A JPS50140063 A JP S50140063A JP 49047348 A JP49047348 A JP 49047348A JP 4734874 A JP4734874 A JP 4734874A JP S50140063 A JPS50140063 A JP S50140063A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
- H01L2224/862—Applying energy for connecting
- H01L2224/8621—Applying energy for connecting with energy being in the form of electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
- H01L2224/868—Bonding techniques
- H01L2224/86801—Soldering or alloying
- H01L2224/86815—Reflow soldering
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49047348A JPS50140063A (en) | 1974-04-25 | 1974-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49047348A JPS50140063A (en) | 1974-04-25 | 1974-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50140063A true JPS50140063A (en) | 1975-11-10 |
Family
ID=12772635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49047348A Pending JPS50140063A (en) | 1974-04-25 | 1974-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50140063A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324255U (en) * | 1976-08-09 | 1978-03-01 | ||
| JPS5324259U (en) * | 1976-08-09 | 1978-03-01 | ||
| JPS5324254U (en) * | 1976-08-09 | 1978-03-01 | ||
| JPH0360138A (en) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | Bonding method |
-
1974
- 1974-04-25 JP JP49047348A patent/JPS50140063A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324255U (en) * | 1976-08-09 | 1978-03-01 | ||
| JPS5324259U (en) * | 1976-08-09 | 1978-03-01 | ||
| JPS5324254U (en) * | 1976-08-09 | 1978-03-01 | ||
| JPS5727141Y2 (en) * | 1976-08-09 | 1982-06-14 | ||
| JPH0360138A (en) * | 1989-07-28 | 1991-03-15 | Nec Kansai Ltd | Bonding method |