JPS50137327U - - Google Patents
Info
- Publication number
- JPS50137327U JPS50137327U JP4817674U JP4817674U JPS50137327U JP S50137327 U JPS50137327 U JP S50137327U JP 4817674 U JP4817674 U JP 4817674U JP 4817674 U JP4817674 U JP 4817674U JP S50137327 U JPS50137327 U JP S50137327U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4817674U JPS5334347Y2 (en:Method) | 1974-04-30 | 1974-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4817674U JPS5334347Y2 (en:Method) | 1974-04-30 | 1974-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50137327U true JPS50137327U (en:Method) | 1975-11-12 |
| JPS5334347Y2 JPS5334347Y2 (en:Method) | 1978-08-23 |
Family
ID=28187702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4817674U Expired JPS5334347Y2 (en:Method) | 1974-04-30 | 1974-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5334347Y2 (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5367880A (en) * | 1976-11-29 | 1978-06-16 | Matsushita Electric Industrial Co Ltd | Device for cutting lead wire of printed board |
| JPS5931264U (ja) * | 1982-08-20 | 1984-02-27 | 株式会社弘輝 | プリント配線基板の移送装置 |
| JP2008091372A (ja) * | 2006-09-29 | 2008-04-17 | Omron Corp | 基板支持装置 |
-
1974
- 1974-04-30 JP JP4817674U patent/JPS5334347Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5367880A (en) * | 1976-11-29 | 1978-06-16 | Matsushita Electric Industrial Co Ltd | Device for cutting lead wire of printed board |
| JPS5931264U (ja) * | 1982-08-20 | 1984-02-27 | 株式会社弘輝 | プリント配線基板の移送装置 |
| JP2008091372A (ja) * | 2006-09-29 | 2008-04-17 | Omron Corp | 基板支持装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5334347Y2 (en:Method) | 1978-08-23 |