JPS50136357U - - Google Patents
Info
- Publication number
- JPS50136357U JPS50136357U JP4772474U JP4772474U JPS50136357U JP S50136357 U JPS50136357 U JP S50136357U JP 4772474 U JP4772474 U JP 4772474U JP 4772474 U JP4772474 U JP 4772474U JP S50136357 U JPS50136357 U JP S50136357U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4772474U JPS50136357U (zh) | 1974-04-25 | 1974-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4772474U JPS50136357U (zh) | 1974-04-25 | 1974-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50136357U true JPS50136357U (zh) | 1975-11-10 |
Family
ID=28186437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4772474U Pending JPS50136357U (zh) | 1974-04-25 | 1974-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50136357U (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61160946A (ja) * | 1984-12-31 | 1986-07-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 半導体装置の接続構造体 |
| WO2001026147A1 (fr) * | 1999-10-04 | 2001-04-12 | Seiko Epson Corporation | Dispositif a semi-conducteur, son procede de fabrication, carte de circuit imprime et dispositif electronique |
| WO2001026155A1 (fr) * | 1999-10-01 | 2001-04-12 | Seiko Epson Corporation | Dispositif a semi-conducteur, procede et dispositif permettant d'obtenir ce dernier, carte de circuit imprime et equipement electronique |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS509341A (zh) * | 1973-05-23 | 1975-01-30 |
-
1974
- 1974-04-25 JP JP4772474U patent/JPS50136357U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS509341A (zh) * | 1973-05-23 | 1975-01-30 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61160946A (ja) * | 1984-12-31 | 1986-07-21 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 半導体装置の接続構造体 |
| WO2001026155A1 (fr) * | 1999-10-01 | 2001-04-12 | Seiko Epson Corporation | Dispositif a semi-conducteur, procede et dispositif permettant d'obtenir ce dernier, carte de circuit imprime et equipement electronique |
| WO2001026147A1 (fr) * | 1999-10-04 | 2001-04-12 | Seiko Epson Corporation | Dispositif a semi-conducteur, son procede de fabrication, carte de circuit imprime et dispositif electronique |
| US6744122B1 (en) | 1999-10-04 | 2004-06-01 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |