JPS50134376A - - Google Patents
Info
- Publication number
- JPS50134376A JPS50134376A JP4071274A JP4071274A JPS50134376A JP S50134376 A JPS50134376 A JP S50134376A JP 4071274 A JP4071274 A JP 4071274A JP 4071274 A JP4071274 A JP 4071274A JP S50134376 A JPS50134376 A JP S50134376A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4071274A JPS50134376A (ru) | 1974-04-09 | 1974-04-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4071274A JPS50134376A (ru) | 1974-04-09 | 1974-04-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50134376A true JPS50134376A (ru) | 1975-10-24 |
Family
ID=12588182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4071274A Pending JPS50134376A (ru) | 1974-04-09 | 1974-04-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50134376A (ru) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5679434A (en) * | 1979-11-30 | 1981-06-30 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
US7772677B2 (en) | 2006-02-02 | 2010-08-10 | Fuji Electric Systems Co., Ltd. | Semiconductor device and method of forming the same having a junction termination structure with a beveled sidewall |
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1974
- 1974-04-09 JP JP4071274A patent/JPS50134376A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5679434A (en) * | 1979-11-30 | 1981-06-30 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
US7772677B2 (en) | 2006-02-02 | 2010-08-10 | Fuji Electric Systems Co., Ltd. | Semiconductor device and method of forming the same having a junction termination structure with a beveled sidewall |