JPS50133780A - - Google Patents

Info

Publication number
JPS50133780A
JPS50133780A JP3888874A JP3888874A JPS50133780A JP S50133780 A JPS50133780 A JP S50133780A JP 3888874 A JP3888874 A JP 3888874A JP 3888874 A JP3888874 A JP 3888874A JP S50133780 A JPS50133780 A JP S50133780A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3888874A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3888874A priority Critical patent/JPS50133780A/ja
Publication of JPS50133780A publication Critical patent/JPS50133780A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP3888874A 1974-04-08 1974-04-08 Pending JPS50133780A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3888874A JPS50133780A (ja) 1974-04-08 1974-04-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3888874A JPS50133780A (ja) 1974-04-08 1974-04-08

Publications (1)

Publication Number Publication Date
JPS50133780A true JPS50133780A (ja) 1975-10-23

Family

ID=12537736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3888874A Pending JPS50133780A (ja) 1974-04-08 1974-04-08

Country Status (1)

Country Link
JP (1) JPS50133780A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152756A (ja) * 1991-11-28 1993-06-18 Nec Corp プリント配線基板の積層方法
JP2016157924A (ja) * 2015-02-24 2016-09-01 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板および回路基板組立体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05152756A (ja) * 1991-11-28 1993-06-18 Nec Corp プリント配線基板の積層方法
JP2016157924A (ja) * 2015-02-24 2016-09-01 サムソン エレクトロ−メカニックス カンパニーリミテッド． 回路基板および回路基板組立体

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