JPS50131765A - - Google Patents

Info

Publication number
JPS50131765A
JPS50131765A JP3793874A JP3793874A JPS50131765A JP S50131765 A JPS50131765 A JP S50131765A JP 3793874 A JP3793874 A JP 3793874A JP 3793874 A JP3793874 A JP 3793874A JP S50131765 A JPS50131765 A JP S50131765A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3793874A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3793874A priority Critical patent/JPS50131765A/ja
Publication of JPS50131765A publication Critical patent/JPS50131765A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP3793874A 1974-04-05 1974-04-05 Pending JPS50131765A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3793874A JPS50131765A (ja) 1974-04-05 1974-04-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3793874A JPS50131765A (ja) 1974-04-05 1974-04-05

Publications (1)

Publication Number Publication Date
JPS50131765A true JPS50131765A (ja) 1975-10-18

Family

ID=12511486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3793874A Pending JPS50131765A (ja) 1974-04-05 1974-04-05

Country Status (1)

Country Link
JP (1) JPS50131765A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283169A (en) * 1975-12-31 1977-07-11 Shinkawa Seisakusho Kk Apparatus for supersonic wire bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283169A (en) * 1975-12-31 1977-07-11 Shinkawa Seisakusho Kk Apparatus for supersonic wire bonding
JPS5441465B2 (ja) * 1975-12-31 1979-12-08

Similar Documents

Publication Publication Date Title
FR2330380B1 (ja)
JPS50103851A (ja)
AU495930B2 (ja)
JPS50131765A (ja)
JPS49106673A (ja)
JPS5119661U (ja)
BG20950A1 (ja)
BG21351A1 (ja)
AU480247A (ja)
AU480471A (ja)
AU480758A (ja)
AU479931A (ja)
AU479765A (ja)
BG19768A1 (ja)
BG19847A1 (ja)
BG19987A1 (ja)
BG20440A1 (ja)
BG20446A1 (ja)
BG20451A1 (ja)
BG20462A1 (ja)
BG20638A1 (ja)
BG20854A1 (ja)
BG20883A1 (ja)
BG20885A1 (ja)
BG22709A1 (ja)