JPS5012974A - - Google Patents
Info
- Publication number
- JPS5012974A JPS5012974A JP6085973A JP6085973A JPS5012974A JP S5012974 A JPS5012974 A JP S5012974A JP 6085973 A JP6085973 A JP 6085973A JP 6085973 A JP6085973 A JP 6085973A JP S5012974 A JPS5012974 A JP S5012974A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6085973A JPS5012974A (enExample) | 1973-06-01 | 1973-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6085973A JPS5012974A (enExample) | 1973-06-01 | 1973-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5012974A true JPS5012974A (enExample) | 1975-02-10 |
Family
ID=13154516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6085973A Pending JPS5012974A (enExample) | 1973-06-01 | 1973-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5012974A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5496323A (en) * | 1978-01-17 | 1979-07-30 | Canon Inc | Television camera |
| JPH01295431A (ja) * | 1988-05-24 | 1989-11-29 | Hitachi Ltd | ワイヤボンディング方法 |
-
1973
- 1973-06-01 JP JP6085973A patent/JPS5012974A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5496323A (en) * | 1978-01-17 | 1979-07-30 | Canon Inc | Television camera |
| JPH01295431A (ja) * | 1988-05-24 | 1989-11-29 | Hitachi Ltd | ワイヤボンディング方法 |