JPS5012772B1 - - Google Patents
Info
- Publication number
- JPS5012772B1 JPS5012772B1 JP45048744A JP4874470A JPS5012772B1 JP S5012772 B1 JPS5012772 B1 JP S5012772B1 JP 45048744 A JP45048744 A JP 45048744A JP 4874470 A JP4874470 A JP 4874470A JP S5012772 B1 JPS5012772 B1 JP S5012772B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45048744A JPS5012772B1 (en) | 1970-06-08 | 1970-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45048744A JPS5012772B1 (en) | 1970-06-08 | 1970-06-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5012772B1 true JPS5012772B1 (en) | 1975-05-14 |
Family
ID=12811777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45048744A Pending JPS5012772B1 (en) | 1970-06-08 | 1970-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5012772B1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332052U (en) * | 1976-08-26 | 1978-03-20 | ||
| KR20180021192A (en) | 2015-10-06 | 2018-02-28 | 미쓰비시덴키 가부시키가이샤 | Method for manufacturing semiconductor device |
| DE102013219959B4 (en) | 2013-02-06 | 2019-04-18 | Mitsubishi Electric Corp. | Semiconductor device and method for manufacturing the same |
| US20220013371A1 (en) * | 2018-11-07 | 2022-01-13 | Danfoss Silicon Power Gmbh | Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module |
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1970
- 1970-06-08 JP JP45048744A patent/JPS5012772B1/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332052U (en) * | 1976-08-26 | 1978-03-20 | ||
| DE102013219959B4 (en) | 2013-02-06 | 2019-04-18 | Mitsubishi Electric Corp. | Semiconductor device and method for manufacturing the same |
| KR20180021192A (en) | 2015-10-06 | 2018-02-28 | 미쓰비시덴키 가부시키가이샤 | Method for manufacturing semiconductor device |
| US20220013371A1 (en) * | 2018-11-07 | 2022-01-13 | Danfoss Silicon Power Gmbh | Mold tool for molding a semiconductor power module with top-sided pin connectors and method of manufacturing such a semiconductor power module |