JPS5012660U - - Google Patents

Info

Publication number
JPS5012660U
JPS5012660U JP6441573U JP6441573U JPS5012660U JP S5012660 U JPS5012660 U JP S5012660U JP 6441573 U JP6441573 U JP 6441573U JP 6441573 U JP6441573 U JP 6441573U JP S5012660 U JPS5012660 U JP S5012660U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6441573U
Other languages
Japanese (ja)
Other versions
JPS5335406Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973064415U priority Critical patent/JPS5335406Y2/ja
Publication of JPS5012660U publication Critical patent/JPS5012660U/ja
Application granted granted Critical
Publication of JPS5335406Y2 publication Critical patent/JPS5335406Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP1973064415U 1973-05-30 1973-05-30 Expired JPS5335406Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973064415U JPS5335406Y2 (enrdf_load_stackoverflow) 1973-05-30 1973-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973064415U JPS5335406Y2 (enrdf_load_stackoverflow) 1973-05-30 1973-05-30

Publications (2)

Publication Number Publication Date
JPS5012660U true JPS5012660U (enrdf_load_stackoverflow) 1975-02-08
JPS5335406Y2 JPS5335406Y2 (enrdf_load_stackoverflow) 1978-08-30

Family

ID=28227729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973064415U Expired JPS5335406Y2 (enrdf_load_stackoverflow) 1973-05-30 1973-05-30

Country Status (1)

Country Link
JP (1) JPS5335406Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642398A (en) * 1979-09-17 1981-04-20 Hitachi Ltd Heat sink for hybrid integrated circuit

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4117856Y1 (enrdf_load_stackoverflow) * 1966-01-06 1966-08-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4117856Y1 (enrdf_load_stackoverflow) * 1966-01-06 1966-08-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5642398A (en) * 1979-09-17 1981-04-20 Hitachi Ltd Heat sink for hybrid integrated circuit

Also Published As

Publication number Publication date
JPS5335406Y2 (enrdf_load_stackoverflow) 1978-08-30

Similar Documents

Publication Publication Date Title
AR201758A1 (enrdf_load_stackoverflow)
AU476761B2 (enrdf_load_stackoverflow)
AU465372B2 (enrdf_load_stackoverflow)
AR201235Q (enrdf_load_stackoverflow)
AR201231Q (enrdf_load_stackoverflow)
AU474593B2 (enrdf_load_stackoverflow)
AU474511B2 (enrdf_load_stackoverflow)
AU474838B2 (enrdf_load_stackoverflow)
AU465453B2 (enrdf_load_stackoverflow)
AU471343B2 (enrdf_load_stackoverflow)
AU465434B2 (enrdf_load_stackoverflow)
AU450229B2 (enrdf_load_stackoverflow)
AU476714B2 (enrdf_load_stackoverflow)
AR201229Q (enrdf_load_stackoverflow)
AU466283B2 (enrdf_load_stackoverflow)
AR199451A1 (enrdf_load_stackoverflow)
AU476696B2 (enrdf_load_stackoverflow)
AU472848B2 (enrdf_load_stackoverflow)
AU477823B2 (enrdf_load_stackoverflow)
AR193950A1 (enrdf_load_stackoverflow)
AU476873B1 (enrdf_load_stackoverflow)
AR200256A1 (enrdf_load_stackoverflow)
AU461342B2 (enrdf_load_stackoverflow)
AR210729A1 (enrdf_load_stackoverflow)
AU477824B2 (enrdf_load_stackoverflow)